TPS65263-Q1

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SLVSCS9C – DECEMBER 2014 – REVISED NOVEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

PVIN1, PVIN2, PVIN3,VIN

–0.3

20

V

LX1, LX2, LX3 (Maximum withstand voltage transient < 20 ns)

–1.0

20

V

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

–0.3

7

V

EN1, EN2, EN3, V7V, VOUT2, SCL, SDA, PGOOD

–0.3

7

V

FB1, FB2, FB3, COMP1 , COMP2, COMP3, ROSC, SS1, SS2, SS3

–0.3

3.6

V

AGND, PGND1, PGND2, PGND3

–0.3

0.3

V

Operating junction temperature

–40

150

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

PVIN1, PVIN2, PVIN3,VIN

4

18

V

LX1, LX2, LX3 (Maximum withstand voltage transient <20 ns)

–0.8

18

V

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

–0.1

6.8

V

EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA

–0.1

6.3

V

FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3

–0.1

3

V

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS65263-Q1

RHB (VQFN)

UNIT

32 PINS

Junction-to-ambient thermal resistance

33.3

°C/W

Junction-to-case (top) thermal resistance

25.7

°C/W

Junction-to-board thermal resistance

7.4

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

7.3

°C/W

Junction-to-case (bottom) thermal resistance

2.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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