1

GaAs DPDT Diversity Switch

0.5 - 3.0 GHz

Rev. V1

MASW-009460

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

Features

 Low Insertion Loss 0.7 dB at 2.4 GHz

 Ideal for WLAN IEEE 802.11b

 0.5 micron GaAs pHEMT Process

 Lead-Free 3 mm 12-Lead PQFN Package

 Halogen-Free ―Green‖ Mold Compound

 260°C Reflow Compatible

 RoHS* Compliant version of MASWSS0040

Description

M/A-COM’s MASW-009460 is a GaAs pHEMT

MMIC DPDT diversity switch in a lead-free 3 mm 12-

lead PQFN package. The MASW-009460 is ideally

suited for applications where very small size and low

cost are required.

Typical applications are for WLAN IEEE 802.11b/g

systems that employ two antennas for transmit and

receive diversity.

This part is designed for low

insertion loss and allows for independent control and

selection of each switch path. This part can be used

in all systems operating up to 3.0 GHz requiring

moderate power and diversity switching.

The MASW-009460 is fabricated using a 0.5 micron

gate length GaAs pHEMT process. The process

features full passivation for performance and

reliability.

Part Number

Package

MASW-009460-TR1000

1000 piece reel

MASW-009460-TR3000

3000 piece reel

MASW-009460-001SMB

Sample Test Board

Pin No.

Pin Name

Description

1

Ctrl 1

Control 1

2

Port 3

RF Port 3

3

Ctrl 4

Control 4

4

N/C

No Connection

5

Port 2

RF Port 2

6

N/C

No Connection

7

Ctrl 3

Control 3

8

Port 4

RF Port 4

9

Ctrl 2

Control 2

10

N/C

No Connection

11

Port 1

RF Port 1

12

N/C

No Connection

Pad

RF & DC Ground

Pin Configuration

Functional Schematic

1. Reference Application Note M513 for reel size information.

2. All sample boards include 5 loose parts.

* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

3. The exposed pad centered on the package bottom must be

connected to the RF and DC ground.