8.0

7.5

7.0

6.5

6.0

-50

-25

0

25

50

75

100 125 150

TEMPERATURE (°C)

300

280

260

240

220

200

-50

-25

0

25

50

75

100 125 150

TEMPERATURE (°C)

300k

250k

200k

150k

100k

50k

0

80

90

100

110

120

130

140

C11 = 2.2 nF, R3 = 348 k:

95.0

90.0

85.0

80.0

75.0

80

90

100

110

120

130

140

14 Series connected LEDs

10 Series connected LEDs

LM3445

SNVS570M – JANUARY 2009 – REVISED NOVEMBER 2015

www.ti.com

Electrical Characteristics (continued)

=

−40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Rise time

15

ns

Fall time

15

THERMAL SHUTDOWN

Thermal shutdown temperature

165

°C

Thermal shutdown hysteresis

20

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation

and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient

6.6 Typical Characteristics

Figure 2. Efficiency vs Input Line Voltage

Figure 3. BLDR Resistor vs Temperature

6

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