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LM5007MMX Datasheet(PDF) 3 Page - Texas Instruments |
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LM5007MMX Datasheet(HTML) 3 Page - Texas Instruments |
3 / 25 page 1 2 3 4 5 6 7 8 SW BST RCL FB RTN RON VCC VIN LM5007 www.ti.com SNVS252G – SEPTEMBER 2003 – REVISED NOVEMBER 2015 5 Pin Configuration and Functions DGK Package and NGT Package 8-Pin VSSOP and 8-Pin WSON Top View Pin Functions PIN TYPE DESCRIPTION APPLICATION INFORMATION NO. NAME 1 SW O Switching Node Power switching node. Connect to the LC output filter. 2 BST I Boost Boot–strap capacitor input An external capacitor is required between the BST and the SW pins. A 0.01-µF ceramic capacitor is recommended. An internal diode between VCC and BST completes the Buck gate drive bias network. 3 RCL I Current Limit OFF time programming pin A resistor between this pin and RTN determines the Toff = 10-5 / (0.59 + (FB / 7.22 x 10− 6 x RCL)) variation of off time, along with the FB pin voltage, per cycle while in current limit. The off time is preset to 17 µS if FB =0 V and decreases as the FB pin voltage increases. 4 RTN — Circuit Ground 5 FB I Feedback Signal from Regulated Output This pin is connected to the inverting input of the internal regulation comparator. The regulation threshold is 2.5 V. 6 RON I On time set pin A resistor between this pin and VIN sets the switch on Ton = 1.42 x 10-10 RON / VIN time as a function of VIN. The minimum recommended on time is 300 ns at the maximum input voltage. 7 VCC O Output from the internal high voltage bias If an auxiliary voltage is available to raise the voltage regulator. VCC is nominally regulated to 7 V. on this pin, above the regulation set point (7V), the internal series pass regulator will shutdown, reducing the IC power dissipation. Do not exceed 14V. This output provides gate drive power for the internal Buck switch. An internal diode is provided between this pin and the BST pin. A local 0.1uF decoupling capacitor is recommended. Series pass regulator is current limited to 10mA. 8 VIN I Input supply voltage Recommended operating range: 9V to 75V. — EP — Exposed PAD, underside of the WSON Internally bonded to the die substrate. Connect to package option GND potential for low thermal impedance. Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM5007 |
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