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LM5114 Datasheet(PDF) 4 Page - Texas Instruments

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Part # LM5114
Description  Single 7.6-A Peak Current Low-Side Gate Driver
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM5114 Datasheet(HTML) 4 Page - Texas Instruments

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LM5114
SNVS790F – JANUARY 2012 – REVISED NOVEMBER 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD to VSS
−0.3
14
V
IN, INB to VSS
−0.3
14
V
N_OUT to VSS
−0.3
VDD + 0.3
V
P_OUT to VSS
−0.3
VDD + 0.3
V
Junction temperature
150
°C
Storage temperature, Tstg
−55
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-
±1000
V
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
4
12.6
V
Junction temperature
40
125
°C
7.4 Thermal Information
LM5114
THERMAL METRIC(1)
DBV (SOT-23)
NGG (WSON)
UNIT
6 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
108.1
51.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
54.2
47.0
°C/W
RθJB
Junction-to-board thermal resistance
24.9
25.3
°C/W
ψJT
Junction-to-top characterization parameter
1.3
0.6
°C/W
ψJB
Junction-to-board characterization parameter
23.9
25.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
NA
5.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: LM5114


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