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MA4SW510B-1 Datasheet(PDF) 5 Page - M/A-COM Technology Solutions, Inc. |
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MA4SW510B-1 Datasheet(HTML) 5 Page - M/A-COM Technology Solutions, Inc. |
5 / 7 page HMIC™ Silicon SP5T PIN Diode Switch with Integrated Bias Network Rev. V4 MA4SW510B-1 5 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 5 Chip Dimensions5,6 DIM Mils Millimeters Min. Max. Min. Max. A 54.0 55.0 1.37 1.40 B 27.0 28.0 0.69 0.71 C 30.0 31.0 0.76 0.79 D 31.0 32.0 0.79 0.81 E 19.0 20.0 0.48 0.51 F 118.5 120.5 3.01 3.06 G 35.0 36.0 0.89 0.91 RF Bond Pads (J1 - J6) 7.0 x 5.0 ref. 0.178 x 0.127 ref. DC Bond Pads (B2 - B6) 5.0 x 5.0 ref. 0.127 x 0.127 ref. Chip Thickness 5.0 ref. 0.127 ref. 5. Topside and backside metallization is gold, 2.5 µm thick typical. 6. Yellow areas indicate wire bonding pads. |
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