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SPX2810 Datasheet(PDF) 4 Page - Sipex Corporation |
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SPX2810 Datasheet(HTML) 4 Page - Sipex Corporation |
4 / 13 page 4 Date: 5/25/04 SPX2810 1A Low Dropout Linear Regulator © Copyright 2004 Sipex Corporation Output Capacitor To ensure the stability of the SPX1202, an output capacitor of at least 10 µF (tantalum or ceramic) or 50 µF (aluminum) is required. The value may change based on the application requirements of the output load or temperature range. The value of ESR can vary based on the type of capacitor used in the applications. The recommended value for ESR is 0.5 Ω or less. A larger value of output capacitance (up to 100 µF) can improve the load transient response. SOLDERING METHODS The SPX2810 SOT-223 package is designed to be compatible with infrared reflow or vapor- phase reflow soldering techniques. During sol- dering, the non-active or mildly active fluxes may be used. The SPX2810 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65 °C of the soldering tem- perature range. THERMAL CHARACTERISTICS The thermal resistance of SPX2810 depends on type of package and PC board layout as shown in Table 1. The SPX2810 features the internal thermal limiting to protect the device during overload conditions. Special care needs to be taken during continuous load conditions such that the maximum junction temperature does not exceed 125 °C. Thermal protection is acti- vated at >144 °C and deactiviated at <137°C. Taking the FR-4 printed circuit board and 1/16 thick with 1 ounce copper foil as an experiment, the PCB material is effective at transmitting heat with the tab attached to the pad area and a ground plane layer on the backside of the sub- strate. Refer to table 1 for the results of the experiment. The thermal interaction from other components in the application can effect the thermal resis- tance of the SPX2810. The actual thermal resis- tance can be determined with experimentation. SPX2810 power dissipation is calculated as follows: P D = (VIN - VOUT)(IOUT) Maximum Junction Temperature range: T J = TAMBIENT (max) + PD* (Junction to ambient Thermal Resistance) Although the SPX2810 offers some limiting circuitry for overload conditions, it is still nec- essary to insure that maximum junction tepmerature is not exceeded. Heat will flow through the lowest resistance path, in this case the junction to case. Therfore proper mounting of the regulator to the board is critical. The case of the device is electrically connected to the output. If the case must be electrically isolated, a thermal nonconductive spacer should be used between the case and the board. It thermal resis- tance must be taken into account. For example: V IN =10V, VOUT =5V. IOUT =1.5A and TA =50°C/W Theta JC=3°C/W, thetaSinkCase= 6°C/W theta Sink=0.5°C/W Power dissipation is calculated as P D= (VIN-VOUT)* IOUT=7.5W Junction Temperature will be T J=TA + PD*(thetaCase-Hs +thetaHs + thetaJc) or T J = 50 + 7.5(0.5+6+3) = 121.25°C Figure 7. Substrate Layout for SOT-223 for thermal experiment. 50 X 50mm 35 X 17mm 16 X 10mm APPLICATION INFORMATION |
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