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LM53635MQRNLTQ1 Datasheet(PDF) 3 Page - Texas Instruments |
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LM53635MQRNLTQ1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 7 page 3 LM53625-Q1, LM53635-Q1 www.ti.com SNVSAA7 – DECEMBER 2015 Product Folder Links: LM53625-Q1 LM53635-Q1 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated 5 Device and Documentation Support 5.1 Documentation Support 5.1.1 Related Documentation Table 1. Resources for Thermal PCB Design TITLE LINK AN-2020 Thermal Design By Insight, Not Hindsight SNVA419 AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages SNVA183 SPRA953B Semiconductor and IC Package Thermal Metrics SPRA953 SNVA719 Thermal Design made Simple with LM43603 and LM43602 SNVA719 SLMA002 PowerPAD™ Thermally Enhanced Package SLMA002 SLMA004 PowerPAD Made Easy SLMA004 5.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM53625-Q1 Click here Click here Click here Click here Click here LM53635-Q1 Click here Click here Click here Click here Click here 5.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.4 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. 5.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. |
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