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6 Date: 8/25/04 SPX1117 800mA Low Dropout Voltage Regulator © Copyright 2004 Sipex Corporation Output Capacitor To ensure the stability of the SPX1117, an output capacitor of at least 2.2 µF (tantalum or ceramic) or 10 µF (aluminum) is required. The value may change based on the application requirements of the output load or temperature range. The value of ESR can vary based on the type of capacitor used in the applications to guarantee stability. The recommended value for ESR is 0.5 Ω or less. A larger value of output capacitance (up to 100 µF) can improve the load transient response. Soldering Methods The SPX1117 SOT-223 package is designed to be compatible with infrared reflow or vapor-phase reflow soldering techniques. During soldering, the non-active or mildly active fluxes may be used. The SPX1117 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65 °C of the soldering temperature range. Figure 16. Load Step Response (0 to 800mA), Vin=3.3V, Vout=1.8V, Cin=10 µF, Cout=2.2µF, Ceramic; 1 = Vout, 4= Iload Figure 17. Load Step Response (0 to 800mA), Vin=3.3V, Vout=1.8V, Cin=10 µF, Cout=2.2µF, OSCON; 1 = Vout, 4= Iload APPLICATION INFORMATION |
