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TPS3823-30QDBVRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS3823-30QDBVRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 24 page TPS3820-33-Q1, TPS3820-50-Q1, TPS3823-25-Q1 TPS3823-30-Q1, TPS3823-33-Q1, TPS3823-50-Q1, TPS3824-30-Q1, TPS3824-33-Q1 TPS3824-50-Q1, TPS3825-33-Q1, TPS3825-50-Q1, TPS3828-33-Q1, TPS3828-50-Q1 SGLS143C – DECEMBER 2002 – REVISED DECEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VDD –0.3 6 Voltage V RESET, RESET, MR, WDI –0.3 (VDD + 0.3) Maximum low output, IOL –5 5 Current Maximum high output, IOH –5 5 mA Output range (VO < 0 or VO > VDD), IOK –10 10 Continuous total power dissipation See Thermal Information Operating free-air, TA –40 125 Temperature °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted). MIN NOM MAX UNIT VDD Supply voltage 1.1 5.5 V VI Input voltage 0 VDD + 0.3 V VIH High-level input voltage at MR and WDI 0.7 × VDD V VIL Low-level input voltage 0.3 × VDD V Δt/ΔV Input transition rise and fall rate at MR or WDI 100 ns/V TA Operating free-air temperature range –40 125 °C 7.4 Thermal Information TPS382x-xx-Q1 THERMAL METRIC(1) DBV (SOT-23) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 209.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.8 °C/W RθJB Junction-to-board thermal resistance 36.7 °C/W ψJT Junction-to-top characterization parameter 2.1 °C/W ψJB Junction-to-board characterization parameter 35.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated Product Folder Links: TPS3820-33-Q1 TPS3820-50-Q1 TPS3823-25-Q1 TPS3823-30-Q1 TPS3823-33-Q1 TPS3823- 50-Q1 TPS3824-30-Q1 TPS3824-33-Q1 TPS3824-50-Q1 TPS3825-33-Q1 TPS3825-50-Q1 TPS3828-33-Q1 TPS3828-50-Q1 |
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