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TPS3702-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS3702-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS3702-Q1 SBVS261B – APRIL 2015 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD –0.3 20 V Voltage VUV, VOV –0.3 20 V VSENSE, VSET –0.3 7 V Current IUV, IOV ±40 mA Continuous total power dissipation See the Thermal Information Operating junction temperature, TJ (2) –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) As a result of the low dissipated power in this device, it is assumed that TJ = TA. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply pin voltage 2 18 V VSENSE Input pin voltage 0 6.5 V VSET SET pin voltage 0 6.5 V VUV, VOV Output pin voltage 0 18 V IUV, IOV Output pin current 0.3 10 mA RPU Pull-up resistor 2.2 10,000 k Ω 6.4 Thermal Information TPS3702-Q1 THERMAL METRIC(1) DDC (SOT) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 201.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 47.8 °C/W RθJB Junction-to-board thermal resistance 51.2 °C/W ψJT Junction-to-top characterization parameter 0.7 °C/W ψJB Junction-to-board characterization parameter 50.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPS3702-Q1 |
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