TGA2590

6-12 GHz 30W GaN Power Amplifier

Datasheet: Rev - 05-08-14

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Disclaimer: Subject to change without notice

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www.triquint.com

Thermal and Reliability Information

Parameter

Test Conditions

Value

Units

Thermal Resistance (

85 W

1.3

ºC/W

201

°C

1.16E7

Hrs

Thermal Resistance (

109 W

1.4

ºC/W

237

°C

6.15E5

Hrs

Notes:

1. MMIC soldered to 20 mil thick Cu-Mo carrier plate using 1.5 mil thick AuSn solder. Thermal resistance is determined from

the channel to the back of the carrier plate (fixed 85 °C temp.).

Median Lifetime

The information contained on this data sheet is technical information as defined by 22 CFR 120.10 and is therefore

US export controlled. Export or transfer contrary to US law is prohibited.

1E+04

1E+05

1E+06

1E+07

1E+08

1E+09

1E+10

1E+11

1E+12

1E+13

1E+14

1E+15

1E+16

1E+17

1E+18

25

50

75

100

125

150

175

200

225

250

275

Median Lifetime vs. Channel Temperature

FET13