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TPS57060-Q1

SLVSAP2C – DECEMBER 2010 – REVISED FEBRUARY 2016

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Copyright © 2010–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See the Enable and Adjusting Undervoltage Lockout (UVLO) section for details.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

VIN

–0.3

65

V

–0.3

5

BOOT

73

VSENSE

–0.3

3

COMP

–0.3

3

PWRGD

–0.3

6

SS/TR

–0.3

3

RT/CLK

–0.3

3.6

Output voltage

BOOT-PH

8

V

PH

DC voltage

–0.6

65

200 ns

–1

65

30 ns

–2

65

–0.85

65

Voltage difference

PAD to GND

–200

200

mV

Source current

EN

100

μA

BOOT

100

mA

VSENSE

10

μA

PH

Current Limit

RT/CLK

100

μA

Sink current

VIN

Current Limit

COMP

100

μA

PWRGD

10

mA

SS/TR

200

μA

Operating junction temperature

–40

150

°C

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

Charged-device model (CDM), per AEC

Q100-011

All pins

±500

Corner pins (1, 5, 6, and 10)

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN supply voltage

3.5

60

V

Output voltage for adjustable voltage

0.8

VIN

V

Output current capability

0.5

A

Effective input capacitance

3

µF

–40

125

°C