4

bq2947

SLUSB15E – SEPTEMBER 2012 – REVISED FEBRUARY 2016

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(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage range

VDD–VSS

–0.3

30

V

Input voltage range

V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS

–0.3

30

V

Output voltage range

OUT–VSS

–0.3

30

V

See Thermal Information

300

°C

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

±2000

V

Charged device model (CDM), per JEDEC specification

±500

7.3 Recommended Operating Conditions

Over-operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3

20

V

Input voltage range

V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS

0

5

V

–40

110

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

7.4 Thermal Information

bq2947

UNIT

SON

8 PINS

Junction-to-ambient thermal resistance

62

°C/W

Junction-to-case(top) thermal resistance

72

Junction-to-board thermal resistance

32.5

Junction-to-top characterization parameter

1.6

Junction-to-board characterization parameter

33

Junction-to-case(bottom) thermal resistance

10