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LT1940EFE Datasheet(PDF) 5 Page - Linear Technology |
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LT1940EFE Datasheet(HTML) 5 Page - Linear Technology |
5 / 20 page LT1940 5 1940i PI FU CTIO S BOOST1, BOOST2 (Pins 1, 8): The BOOST pins are used to provide drive voltages, higher than the input voltage, to the internal bipolar NPN power switches.Tie through a diode from VOUT or from VIN. SW1, SW2 (Pins 2, 7): The SW pins are the outputs of the internal power switches. Connect these pins to the induc- tors, catch diodes and boost capacitors. VIN (Pins 3, 4, 5, 6): The VIN pins supply current to the LT1940’s internal regulator and to the internal power switches. These pins must be tied to the same source, and must be locally bypassed. FB1, FB2 (Pins 9, 16): The LT1940 regulates each feed- back pin to 1.25V. Connect the feedback resistor divider taps to these pins. VC1, VC2 (Pins 10, 15): The VC pins are the outputs of the internal error amps. The voltages on these pins control the peak switch currents. These pins are normally used to compensate the control loops, but can also be used to override the loops. Pull these pins to ground with an open drain to shut down each switching regulator. PG1, PG2 (Pins 11, 14): The Power Good pins are the open collector outputs of an internal comparator. PG remains low until the FB pin is within 10% of the final regulation voltage. As well as indicating output regulation, the PG pins can be used to sequence the two switching regulators. These pins can be left unconnected. The PG outputs are valid when VIN is greater than 2.4V and either of the RUN/SS pins is high. The PG comparators are disabled in shutdown. RUN/SS1, RUN/SS2 (Pins 12, 13): The RUN/SS pins are use to shut down the individual switching regulators and the internal bias circuits. They also provide a soft-start function. To shut down either regulator, pull the RUN/SS pin to ground with an open drain or collector. Tie a capacitor from these pins to ground to limit switch current during start-up. If neither feature is used, leave these pins unconnected. GND (Underside Metal): The underside exposed pad metal of the package provides both electrical contact to ground and good thermal contact to the printed circuit board. The underside must be soldered to the circuit board for proper operation. |
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