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ALN1300 Datasheet(PDF) 1 Page - Advanced Semiconductor Business Inc.

Part # ALN1300
Description  Internally Matche d LNA Module
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Manufacturer  ASB [Advanced Semiconductor Business Inc.]
Direct Link  http://www.asb.co.kr
Logo ASB - Advanced Semiconductor Business Inc.

ALN1300 Datasheet(HTML) 1 Page - Advanced Semiconductor Business Inc.

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www.asb.co.kr
October 2014
plerowTM ALN1300
Internally Matched LNA Module
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Parameter
Unit
Specifications
Min
Typ
Max
Frequency Range
MHz
1200
1400
Gain
dB
38.5
39.5
Gain Flatness
dB
0.5
0.6
Noise Figure
dB
0.7
0.75
Output IP3
dBm
35
36
S11/S22
dB
-15/-15
Output P1dB
dBm
19
20
Switching Time (3)
sec
-
Supply Current
mA
160
180
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 23~25 (before fail)
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40
C to +85C.
1) OIP3 is measured with two tones at an output power of +4 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Pin Number
Function
3
RF In
8
RF Out
10
Vs
Others
Ground
Outline Drawing (Unit: mm)
Features
·
S21 = 40.0 dB@1200 MHz
= 39.0 dB@1400 MHz
·
NF of 0.7 dB over Frequency
·
Unconditionally Stable
·
Single 5 V Supply
·
High OIP3@Low Current
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Description
ALN1300
ASB Inc.
(Top View)
(Bottom View)
Solder Stencil Area
Ø 0.4 plated thru holes to ground plane
plerow
(Side View)
(Recommended Footprint)
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
More Information
2-stage Single Type
Specifications (in Production)
Typ.@T = 25
C, Vs = 5 V, Freq. = 1300 MHz, Zo.sys = 50 ohms


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