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MAX14770EGSA+T Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX14770EGSA+T Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 16 page 2 Maxim Integrated ±35kV High-ESD Profibus RS-485 Transceiver MAX14770E Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Voltages referenced to GND.) VCC.......................................................................-0.3V to +6.0V RE, RO.......................................................-0.3V to (VCC + 0.3V) DE, DI ...................................................................-0.3V to +6.0V A, B.....................................................................-8.0V to +13.0V Short-Circuit Duration (RO, A, B) to GND .................Continuous Continuous Power Dissipation (TA = +70NC) SO (derate 7.6mW/NC above +70NC) .........................606mW TDFN (derate 24.4mW/NC above +70NC) .................1951mW F MAX (derate 4.8mW/NC above +70NC)..................387.8mW Operating Temperature Range MAX14470EESA...............................................-40NC to +85NC MAX14470EG_A............................................. -40NC to +105NC MAX14470EATA............................................. -40NC to +125NC Storage Temperature Range............................ -65NC to +150NC Junction Temperature Range........................... -40NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC ELECTRICAL CHARACTERISTICS (VCC = +5V Q10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V, TA = +25NC.) (Note 2) ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. PACKAGE THERMAL CHARACTERISTICS (Note 1) SO Junction-to-Ambient Thermal Resistance ( qJA)........132°C/W Junction-to-Case Thermal Resistance ( qJC)...............38°C/W µMAX Junction-to-Ambient Thermal Resistance ( qJA).....206.3°C/W Junction-to-Case Thermal Resistance ( qJC)...............42°C/W TDFN Junction-to-Ambient Thermal Resistance ( qJA)..........41°C/W Junction-to-Case Thermal Resistance ( qJC).................8°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Power-Supply Range VCC 4.5 5.5 V Supply Current ICC DE = 1, RE = 0 or DE = 0, RE = 0 or DE = 1, RE = 1; no load 2.5 4 mA Shutdown Supply Current ISH DE = 0, RE = 1 15 F A DRIVER Differential Driver Output |VOD| RL = 54I, DI = VCC or GND; Figure 1 2.1 V Differential Driver Peak-to-Peak Output VODPP Figure 2 (Note 3) 4.0 6.8 V Change in Magnitude of Differential Output Voltage D VOD RL = 54I; Figure 1 (Note 4) -0.2 0 +0.2 V Driver Common- Mode Output Voltage VOC RL = 54I; Figure 1 1.8 3 V Change in Common- Mode Voltage D VOC RL = 54I; Figure 1 (Note 4) -0.2 +0.2 V Driver Short-Circuit Output Current (Note 5) IOSD 0V P VOUT P +12V; output low +250 mA -7V P VOUT P VCC; output high -250 |
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