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70-W212NMA600NB02-M200P62 Datasheet(PDF) 5 Page - Vincotech |
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70-W212NMA600NB02-M200P62 Datasheet(HTML) 5 Page - Vincotech |
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5 / 31 page  70-W212NMA600NB02-M200P62 Parameter Symbol Unit VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] IC [A] or IF [A] or ID [A] Tj Min Typ Max Characteristic Values Value Conditions Tj=25°C 2,19 Tj=125°C 2,47 Tj=25°C 48 Tj=125°C Tj=25°C 448 Tj=125°C 568 Tj=25°C 70 Tj=125°C 138 Tj=25°C 19 Tj=125°C 53 di(rec)max Tj=25°C 20142 /dt Tj=125°C 14965 Tj=25°C 4 Tj=125°C 13 Thermal resistance chip to heatsink per chip RthJH 100um preapplied PCM 0,16 K/W Thermal resistance chip to case per chip RthJH 100um grease 1W/mK 0,18 K/W Tc=25°C, per switch Screw M4 - mounting according to valid application note FSWB1-4TY-M-*-HI Screw M5 - mounting according to valid application note FSWB1-4TY-M-*-HI FSWB1-4TY-M-*-HI A/µs A mWs µC V ns -12 200 2 mW/K Tj=25°C 22000 Tj=25°C Tol. ±3% 3996 Tj=25°C B-value Tj=25°C K 3950 K B(25/100) Vincotech NTC Reference +14 Tj=25°C Tj=100°C B-value B(25/50) Tol. ±3% 350 1200 Reverse recovery time FWD forward voltage Reverse leakage current half bridge FWD (D1, D4) ( D1 , D4 ) trr Qrr Rgon=1 IRRM VF Ir Power dissipation P Rated resistance R ∆R/R Power dissipation constant Deviation of R100 R100=1486 ±15 Thermistor Erec Peak rate of fall of recovery current Reverse recovered charge Reverse recovery energy Peak reverse recovery current 600 400 B % mW µA nH 3 nH 5 Module inductance (from chips to PCB) LsCE C-PCB Module inductance (from PCB to PCB using Intercon board) Module Properties LsCE PCB-PCB Rcc'1+EE' 2 Mounting torque M Resistance of Intercon boards (from PCB to PCB using Intercon board) Mounting torque M Screw M6 - mounting according to valid application note Nm Terminal connection torque M 2,5 Weight G g 710 5 4 2,2 6 Nm Nm 1,5 m copyright by Vincotech 5 Revision: 1.2 |
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