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LM6121 Datasheet(PDF) 3 Page - Texas Instruments

Part # LM6121
Description  High Speed Buffer
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM6121 Datasheet(HTML) 3 Page - Texas Instruments

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OBSOLETE
LM6121
LM6221, LM6321
www.ti.com
SNOSC10C – MAY 1998 – REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage
36V (±18)
Input to Output Voltage (2)
±7V
Input Voltage
±Vsupply
Output Short-Circuit to GND(3)
Continuous
Storage Temperature Range
−65°C to +150°C
Lead Temperature (Soldering, 10 seconds)
260°C
Power Dissipation
(4)
ESD Tolerance (5)
±2000V
Junction Temperature (TJ(MAX))
+150°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2)
During current limit or thermal limit, the input current will increase if the input to output differential voltage exceeds 8V. For input to
output differential voltages in excess of 8V the input current should be limited to ±20 mA.
(3)
The LM6121 series buffers contain current limit and thermal shutdown to protect against fault conditions.
(4)
The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/θJA.
(5)
The test circuit consists of the human body model of 120 pF in series with 1500
Ω.
Operating Ratings
Operating Temperature Range
LM6121H/883
−55°C to +125°C
LM6221
−40°C to +85°C
LM6321
0°C to +70°C
Operating Supply Range
4.75 to ±16V
Thermal Resistance (
θJA),
(1)
H Package
150°C/W
N Package
47°C/W
M Package
69°C/W
Thermal Resistance (
θJC), H Package
17°C/W
(1)
The thermal resistance
θJA of the device in the N package is measured when soldered directly to a printed circuit board, and the heat-
sinking pins (pins 1, 4, 5 and 8) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal resistance
θJA
of the N package is 84°C/W. The thermal resistance
θJA of the device in the M package is measured when soldered directly to a printed
circuit board, and the heat-sinking pins (pins 1, 2, 6, 7, 8, 9, 13, 14) are connected to 1 square inch of 2 oz. copper.
Copyright © 1998–2013, Texas Instruments Incorporated
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Product Folder Links: LM6121 LM6221 LM6321


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