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SRF55V10S Datasheet(PDF) 3 Page - Infineon Technologies AG |
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SRF55V10S Datasheet(HTML) 3 Page - Infineon Technologies AG |
3 / 10 page my-d vicinity SRF 55V10S Short Product Information 3 / 10 2002-07-30 Intelligent 10–KBit EEPROM with Contactless Interface complying to ISO/IEC 15693 and Security Logic my-d vicinity – Secure Mode Operation Features • 10-KBit EEPROM — Organised in 128 pages located in up to 16 sectors — Each page organised in 8 bytes for data storage + 2 bytes for administrative purposes — Configurable number of sectors (1 to 15) & sector size (1 up to 128 pages) — Service Area 4 pages — Configurable Key Area with up to 14 key pairs — Configurable User Area — Unique chip identification number • Smart Electronic Article Surveillance (EAS) — Easy Integration in existing infrastructure — On/Off EAS switch feature • Value Counters: up to 65536 units (with a value range from 0 to 216-1) — Each page in User Area configurable as a Counter — Support of Anti-Tearing • High Security Authentication Unit (optional use) — 2-way (mutual) authentication with 64-bit secret key between reader and label — 2 keys for each sector allow hierarchical key management — Multi-level security structure possible — Individual access rights for each key within a sector for each page — Only one sector can be opened at a time — Data integrity supported by 16 bit CRC (ISO 3309) and 32 bit MAC (after authentication) • Access protection of EEPROM by transport keys on chip delivery (optional use) • Physical Interface and Anticollision complying to ISO/IEC 15693 — Carrier frequency: 13.56 MHz — up to 26 kbit/s data rate transfer — Anticollision method complying with ISO/IEC 15693 with identification of up to 30 tags/sec — Contactless transmission of data and supply energy — Coupling distance from 0 to 120 cm (typical, dependent on antenna) • EEPROM updating (erase and program) time maximum 4 ms per page • EEPROM endurance minimum 10 5 write/erase cycles1) • Data retention for minimum of 10 years 1) • ESD protection typical 4 kV • Ambient temperature –25 … … … … +85°C for chip and MCC, –25 … … … … +70°C for Inlay 1) Values are temperature dependent |
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