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PMPS-E-1206 SERIES

TYPICAL DEVICE CHARACTERISTICS

SOLDERING PARAMETERS

PROFILE FEATURES

PB-FREE ASSEMBLY

Average Ramp-Up Rate -

Tsmin to Tp

3°C/Second Max

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax)

150°C

200°C

60-180 Seconds

Time Maintained Above:

- Temperature (Tm)

- Time (tm)

217°C

60-150 Seconds

Peak Temperature (Tp)

260°C

Time within 5°C of Tp (tp)

20-40 Seconds

Ramp-Down Rate

6°C/Seconds Max

Time 25°C to Tp

8 Minutes Max

1. All temperatures refer to topside of the package, mea-

sured on the package body surface.

2. Recommended reflow methods: IR, Vapor Phase, Hot Air

Oven.

3. Devices are not designed to be wave soldered to the bot-

tom side of the board.

4. Devices can be cleaned using standard industry methods

and solvents.

5. If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

t 25°C to Peak

Time

Ramp-Down

ts Preheat

Tsmin

Tsmax

Tm

Tp

tm

Ramp-Up

Tp

Critical Zone

Tm to Tp

NOTICES

The devices are intended for protection against overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions are antici-

pated. Operation beyond maximum ratings or improper use may result in device damage and possible arcing and flame.

WARNING

Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. Polymeric thermistors operate by

thermal expansion of the conductive polymer. If devices are placed under pressure or installed in space that would prevent thermal expansion, they may not properly

protect against fault conditions. Designs must be selected in such a manner that adequate space is maintained over the life of the product.

Twisting, bending, or placing the Polymeric thermistors in tension will decrease the ability of the device to protect against electrical faults. No residual force should

remain on the device after installation. Mechanical damage to Polymeric thermistors chip may affect device performance and should be avoided.

Chemical contamination of Polymeric thermistors should be avoided. Certain greases, solvents, hydraulic fluids, fuels, industrial cleaning agents, volatile components

of adhesives, silicones and electrolytes can have an adverse effect on the device performance.

Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Avoid use in deoxidizing gases, corrosive agents,

humid or salty conditions. Contact with any liquids and solvents should be prevented. Device performance can be impacted negatively if devices are handled in a

manner inconsistent with recommended electronic, thermal and mechanical procedures for electronic components.