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DRV10964FFDSNR Datasheet(PDF) 4 Page - Texas Instruments |
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DRV10964FFDSNR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page 4 DRV10964 SLDS227 – MARCH 2016 www.ti.com Product Folder Links: DRV10964 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VCC pin supply voltage –0.3 6 V Motor phase pins (U, V, W) –1 7.7 V Direction, speed indicator input, and speed input (FR, FGS, PWM, CONFIG) –0.3 6 V Speed output (FG) –0.3 7.7 V TJ Junction temperature –40 150 °C TSDR Maximum lead soldering temperature, 10 seconds 260 °C Tstg Storage temperature –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500 V Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC VCC pin supply voltage 2.1 5.5 V U, V, W Motor phase pins –0.7 7 V FR, FGS, PWM, CONFIG Direction, speed indicator input, and speed input –0.1 5.5 V FG Speed output –0.1 7.5 V TJ Junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC (1) DRV10964 UNIT DSN (USON) 10 PINS Rθ JA Junction-to-ambient thermal resistance 40.9 °C/W Rθ JC(top) Junction-to-case (top) thermal resistance 46.6 °C/W Rθ JB Junction-to-board thermal resistance 15.8 °C/W ψJT Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 16 °C/W Rθ JC(bot) Junction-to-case (bottom) thermal resistance 2.9 °C/W |
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