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CGHV60075D Rev 0.0

Cree, Inc.

4600 Silicon Drive

Durham, North Carolina, USA 27703

USA Tel: +1.919.313.5300

Fax: +1.919.869.2733

www.cree.com/rf

Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the

Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective

owners and do not imply specific product and/or vendor endorsement, sponsorship or association.

DIE Dimensions (units in microns)

Overalldiesize3000x820(+0/-50)microns,diethickness100microns.

All Gate and Drain pads must be wire bonded for electrical connection.

Assembly Notes:

• RecommendedsolderisAuSn(80/20)solder.RefertoCree’swebsitefortheEutecticDieBondProcedure

applicationnoteatwww.cree.com/wireless.

• Vacuumcolletisthepreferredmethodofpick-up.

• ThebacksideofthedieistheSource(ground)contact.

• Diebacksidegoldplatingis5micronsthickminimum.

• Thermosonicballorwedgebondingarethepreferredconnectionmethods.

• Goldwiremustbeusedforconnections.

• Usethedielabel(XX-YY)forcorrectorientation.