DRV8804

SLVSAW4F – JULY 2011 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VM

Power supply voltage

–0.3

65

V

VOUTx

Output voltage

–0.3

65

V

VCLAMP

Clamp voltage

–0.3

65

V

SDATOUT,

Output current

20

mA

nFAULT

Peak clamp diode current

2

A

DC or RMS clamp diode current

1

A

Digital input pin voltage

–0.5

7

V

SDATOUT,

Digital output pin voltage

–0.5

7

V

nFAULT

Peak motor drive output current, t < 1

μs

Internally limited

A

Continuous total power dissipation

See Thermal Information

Operating virtual junction temperature

–40

150

°C

Storage temperature

–60

150

°C

(1)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Power supply voltage

8.2

60

V

0

60

V

(2)

1.5

(2)

0.8

A

(2)

2

(2)

1

(1)

(2)

Power dissipation and thermal limits must be observed.

6.4 Thermal Information

DRV8804

DW (SOIC)

PWP (HTSSOP)

UNIT

20 PINS

16 PINS

Junction-to-ambient thermal resistance

67.7

39.6

°C/W

Junction-to-case (top) thermal resistance

32.9

24.6

°C/W

Junction-to-board thermal resistance

35.4

20.3

°C/W

Junction-to-top characterization parameter

8.2

0.7

°C/W

Junction-to-board characterization parameter

34.9

20.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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