DRV8312, DRV8332

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SLES256E – MAY 2010 – REVISED DECEMBER 2014

7.4 Thermal Information

DRV8312

DRV8332

DDW

DKD

UNIT

PACKAGE

PACKAGE

44 PINS

36 PINS

13.3

Junction-to-ambient thermal resistance

24.5

(with heat sink)

Junction-to-case (top) thermal resistance

7.8

0.4

Junction-to-board thermal resistance

5.5

13.3

°C/W

Junction-to-top characterization parameter

0.1

0.4

Junction-to-board characterization parameter

5.4

13.3

Junction-to-case (bottom) thermal resistance

0.2

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Dissipation Ratings

PARAMETER

DRV8312

DRV8332

1.1 °C/W

0.9 °C/W

thermal resistance

This device is not intended to be used

25 °C/W

specified. See the Thermal Information

section.

Exposed power pad / heat slug area

7.6 Power Deratings (DRV8312)

(1)

DERATING

FACTOR

PACKAGE

POWER

RATING

RATING

RATING

RATING

25°C

44-PIN TSSOP (DDW)

5.0 W

40.0 mW/°C

3.2 W

2.6 W

1.0 W

(1)

Based on EVM board layout

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