Henkel Corporation.

2

CPR3CK Rev. D (201410)

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703-8475 USA

Tel: +1-919-313-5300

Fax: +1-919-313-5870

www.cree.com/chips

Maximum Ratings at T

Notes 1&3

CxxxMB290-Sxx00

DC Forward Current

30 mA

Peak Forward Current (1/10 duty cycle @ 1kHz)

100 mA

LED Junction Temperature

125°C

Reverse Voltage

5 V

Operating Temperature Range

-40°C to +100°C

LED Chip Storage Temperature

-40°C to +120°C

Recommended Die Sheet Storage Conditions

≤30°C / ≤85% RH

1000 V

Class 2

Typical Electrical/Optical Characteristics at T

Note 3

Part Number

Forward Voltage (V

Reverse Current

[I(Vr=5V), μA]

Full Width Half Max.

(λ

Min.

Typ.

Max.

Max.

Typ.

C460MB290-Sxxxx

2.9

3.2

3.7

2

21

C470MB290-Sxxxx

2.9

3.2

3.7

2

22

C527MB290-Sxxxx

2.9

3.3

3.9

2

35

Mechanical Specifications

CxxxMB290-Sxx00

Description

Dimension

Tolerance

P-N Junction Area (μm)

250 x 250

± 25

Top Area (μm)

300 x 300

± 25

Chip Thickness (μm)

250

± 25

Bottom Area (μm)

200 x 200

± 25

Au Bond Pad Diameter (μm)

112

± 20

Au Bond Pad Thickness (μm)

1.2

± 0.5

Backside Metal Diameter (μm)

104

± 20

Notes:

encapsulant) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by

the die but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of

the thru-hole package; junction temperature should be characterized in a specific package to determine limitations. Assembly

processing temperature must not exceed 325°C (< 5 seconds).

2. Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche

energy test (RAET). The RAET procedures are performed on each die and are designed to approximate the minimum ESD ratings

shown. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E.

3. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled

and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given

are within the range of average values expected by manufacturer in large quantities and are provided for information only. All

measurements were made using lamps in thru-hole packages (with Hysol OS4000 encapsulant). The amount of die attach

adhesive used will affect light output; it is recommended that the adhesive amount be optimized to meet the requirements of each

specific application. Optical characteristics measured in an integrating sphere using Illuminance E.

4. To obtain optimum output efficiency, the maximum height of die attach epoxy on the side of the chip should not exceed 80 μm.

5. Specifications are subject to change without notice.