SN74LVCH16T245

SCES635B – JULY 2005 – REVISED APRIL 2015

www.ti.com

7.4 Thermal Information

SN74LVCH16T245

DL (SSOP)

DGG (TSSOP)

DGV

GQL / ZQL

UNIT

(TVSOP)

(BGA)

48 PINS

48 PINS

48 PINS

56 PINS

Junction-to-ambient thermal resistance

92.9

60

82.5

64.6

°C/W

29.5

13.9

34.2

16.6

°C/W

Junction-to-board thermal resistance

35.5

27.1

45.1

30.8

°C/W

Junction-to-top characterization parameter

8.1

0.5

2.7

0.9

°C/W

Junction-to-board characterization parameter

34.9

26.8

44.6

64.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

(1) (2)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

1.65 V to 4.5 V

1.65 V to 4.5 V

– 0.1

1.65 V

1.65 V

1.2

V

2.3 V

2.3 V

1.9

3 V

3 V

2.4

4.5 V

4.5 V

3.8

1.65 V to 4.5 V

1.65 V to 4.5 V

0.1

1.65 V

1.65 V

0.45

2.3 V

2.3 V

0.3

V

3 V

3 V

0.55

4.5 V

4.5 V

0.55

Control

1.65 V to 5.5 V

1.65 V to 5.5 V

±0.5

±2

μA

inputs

1.65 V

1.65 V

15

2.3 V

2.3 V

45

(3)

μA

3 V

3 V

75

4.5 V

4.5 V

100

1.65 V

1.65 V

–15

2.3 V

2.3 V

–45

(4)

μA

3 V

3 V

–75

4.5 V

4.5 V

–100

1.95 V

1.95 V

200

2.7 V

2.7 V

300

(5)

μA

3.6 V

3.6 V

500

5.5 V

5.5 V

900

1.95 V

1.95 V

–200

2.7 V

2.7 V

–300

(6)

μA

3.6 V

3.6 V

–500

5.5 V

5.5 V

–900

(1)

(2)

(3)

(4)

(5)

(6)

8

Submit Documentation Feedback

Copyright © 2005–2015, Texas Instruments Incorporated

Product Folder Links: SN74LVCH16T245