5

C3D10060G Rev. F

Recommended Solder Pad Layout

Part Number

Package

Marking

C3D10060G

TO-263-2

C3D10060

TO-263-2

Note: Recommended soldering profiles can be found in the applications note here:

http://www.cree.com/power_app_notes/soldering

POS

Inches

Millimeters

Min

Max

Min

Max

A

0.17

0.18

4.32

4.57

A1

-

0.01

-

0.25

b

0.028

0.037

0.71

0.94

b2

0.045

0.055

1.15

1.4

c

0.018

0.024

0.46

0.61

c2

0.048

0.055

1.22

1.4

D

0.35

0.37

8.89

9.4

D1

0.315

0.324

8.01

8.23

E

0.395

0.405

10.04

10.28

E1

0.31

0.318

7.88

8.08

e

0.1

BSC.

2.54

BSC.

L

0.58

0.62

14.73

15.75

L1

0.09

0.11

2.29

2.79

L2

0.045

0.055

1.15

1.39

L3

0.05

0.07

1.27

1.77

θ

0°

8°

0°

8°

Package Dimensions

PackageTO-263-2

PIN1

PIN2

CASE

Note:

*Tab“M”maynotbepresent

M