No.830I/May.2014

Conductive Polymer Hybrid

Aluminum Electrolytic Capacitors

Please contact us for mass production schedule.

Specifications in this bulletin are subject to change without notice.

NIPPON CHEMI-CON CORPORATION

1698

2

PMA

Series

◆STANDARD RATINGS

●Recommended Solder Land(Based on the PX series) [mm]

●Reflow Profile

Location of capacitor

c

a

b

b

Solder land on PC board

217

230

Peak

Preheat

Peak temperature

Time (sec.)

Max. period of time over 230℃

(℃)

Max. period of time over 217℃

◆RECOMMENDED REFLOW SOLDERING CONDITIONS

NIPPON CHEMI-CON CORPORATION

1595

Engineering Bulletin

Conductive Polymer

Aluminum Solid Capacitors

No.824C / Oct.2012

Tentative

2

Cap

(μF)

Rated ripple current

(mArms/100kHz)

Part No.

16

20

25

APMA160ARA680MF40S

40

F40

APMA160ARA151MF60S

18

F60

APMA160ARA390MF40S

2,200

3,300

2,200

2,700

4,100

2,700

40

F40

APMA200ARA470MF40S

45

F40

APMA200ARA151MF60S

20

F60

APMA160ARA221MF60S

2,100

3,200

3,300

2,600

3,700

4,100

18

F60

APMA250ARA220MF40S

50

F40

APMA250ARA560MF60S

26

F60

APMA250ARA150MF40S

2,000

2,800

2,000

2,400

3,400

2,400

50

544

1,200

312

470

1,500

1,760

275

700

187

F40

68

150

39

47

150

220

22

56

15

WV

Size

code

Leakage current

(µAmax/after 2min.)

ESR

(mΩmax/20℃,

100k to 300kHz)

Specifications in this bulletin are subject to change without notice.

Please ask us for technical specifications before purchase and use.

*1 Tx: Ambient temperature

Reflow number

Preheat

Time maintained

above 230℃

Peak temp.

16 to 25V

1-cycle only

150℃ to 180℃

120 sec.max.

50 sec.max.

250℃ max.

30 sec.max.

40 sec.max.

2-cycle allowed

Time maintained

above 217℃

40 sec.max.

Size code

a

b

c

F40,F60

1.6

3.5

1.9

HXA

Series

◆ STANDARD RATINGS

WV

Cap

(μF)

Size code

ESR

(mΩmax/20℃ , 100kHz)

Rated ripple current

(mArms/125℃ , 100kHz)

Part No.

16

82

F61

45

950

HHXA160ARA820MF61G

150

F80

27

1,300

HHXA160ARA151MF80G

270

HA0

22

1,700

HHXA160ARA271MHA0G

470

JA0

18

2,100

HHXA160ARA471MJA0G

25

56

F61

50

900

HHXA250ARA560MF61G

100

F80

30

1,400

HHXA250ARA101MF80G

220

HA0

27

1,600

HHXA250ARA221MHA0G

330

JA0

20

2,000

HHXA250ARA331MJA0G

35

47

F61

60

900

HHXA350ARA470MF61G

68

F80

35

1,400

HHXA350ARA680MF80G

150

HA0

27

1,600

HHXA350ARA151MHA0G

270

JA0

20

2,000

HHXA350ARA271MJA0G

50

22

F61

80

750

HHXA500ARA220MF61G

33

F80

40

1,100

HHXA500ARA330MF80G

68

HA0

30

1,250

HHXA500ARA680MHA0G

100

JA0

28

1,600

HHXA500ARA101MJA0G

63

10

F61

120

700

HHXA630ARA100MF61G

22

F80

80

900

HHXA630ARA220MF80G

33

HA0

40

1,100

HHXA630ARA330MHA0G

56

JA0

30

1,400

HHXA630ARA560MJA0G

80

22

HA0

45

1,100

HHXA800ARA220MHA0G

39

JA0

35

1,200

HHXA800ARA390MJA0G

◆ RECOMMENDED REFLOW SOLDERING CONDITIONS

The following conditions are recommended for air convection and infrared reflow soldering on the SMD products on to a glass epoxy

circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm.

The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.

Reflow should be performed twice or less.

Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃ ) before the second reflow.

●

Reflow Profile

Size Code

Preheat

Time maintained

above 217℃

Time maintained

above 230℃

Peak temp.

Reflow number

F61, F80

150 to 180℃

120 sec. max.

50 sec. max.

40 sec. max.

260℃ max.

2-cycle allowed

HA0, JA0

50 sec. max.

40 sec. max.

260℃ max.

1-cycle only

245℃ max.

2-cycle allowed