SBC

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and Solutions

Systems

on

Modules

Embedded

SBCs

>EPIC

Embedded

SBCs

>3.5" Capa

Embedded

SBCs

>Nano-ITX

Embedded

SBCs

>Pico-ITX

Embedded

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>PC/104

Industrial

Mother-boards

Slot CPU

Cards

ARM

Embedded

Boards

Accessories

Appendix

2

74

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* All specifications and photos are subject to change without notice.

CEM500

NEW

Features

6th Generation Intel® Core™ i7/i5/i3 &

Celeron® Processor COM Express Type 6

Module with Intel® QM170/HM170

(Skylake-H)

I/O

Packing List

System

Quick installation guide, user’s manual/utility CD

Display

Ordering Information

Standard

CEM500PG-i7-6820EQ

COM Express type 6 module with Intel® Core™ i7-6820EQ

2.8 GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM

CEM500PG-i5-6440EQ

COM Express type 6 module with Intel® Core™ i5-6440EQ

2.7 GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM

CEM500PG-i3-6100E

COM Express type 6 module with Intel® Core™ i3-6100E

2.7GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM

Optional

CEB94011

ATX form factor type 6 evaluation board

CPU

6th generation Intel® Core™ processor (Skylake) with

i7-6820EQ (45W), i5-6440EQ (45W), i3-6100E (35W)

System Memory

2 x DDR4-2133 SO-DIMMs support max. up to 32 GB

Chipset

Intel® QM170/HM170

BIOS

AMI uEFI with Intel® Active Management Technology 11.0

supported

SSD

N/A

Watchdog Timer

255 levels, 1~255 sec.

Expansion Interface

1 x PCIe x16 v3.0

8 x PCIe x1 (7 x1 while internal MAC is connected)

Battery Lithium

N/A

Power Input

ATX: +12V, +5VSB; AT: +12V

Size

125 x 95 mm

Board Thickness

2.0 mm

Temperature

-40ºC ~ +85ºC (-40ºF ~ +185ºF), operation

Operation Humidity

10% ~ 95% relative humidity, non-condensing

MIO

1 x LPC interface

1 x SPI interface

1 x I

2 x TX/RX serial interface

SATA

4 x SATA-600 support RAID 0/1/5/10

Hardware Monitoring

Yes

Ethernet

1 port as 10/100/1000Mbps supports Wake-on-LAN,

PXE Boot ROM with Intel® i219LM

Audio

HD link interface to baseboard for Codec

USB

4 x USB 3.0 and 8 x USB 2.0

TPM

ST for trusted platform

SMBus

Yes

Digital I/O

4 channels IN & 4 channels OUT

Smart Battery

Yes

Chipset

Intel® Gen 9 Graphics

Gfx APIs - DX11/12, OCL2.x, OGL 4.3/4.4

3 independent displays

Display Interface

1 x LVDS; 18/24-bit single/dual channel (optional with eDP)

3 x DDI (DP/HDMI/DVI); 1 x DDI optional w/VGA

DDR4

DDR4

DDR4

USB 3.0

USB

USB

TripleView

Full Solid

Cap Design

AiRD

Ext. Temp

COM Express

Interface Connector

2 x DDR4

SO-DIMM

Intel® QM170/

HM170

6th Gen. Intel® Core™ Processor

Rear view