MCR8DSM, MCR8DSN

6

PACKAGE DIMENSIONS

DPAK

CASE 369C

ISSUE O

D

A

K

B

R

V

S

F

L

G

2 PL

M

0.13 (0.005)

T

E

C

U

J

H

PLANE

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.235

0.245

5.97

6.22

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.027

0.035

0.69

0.88

E

0.018

0.023

0.46

0.58

F

0.037

0.045

0.94

1.14

G

0.180 BSC

4.58 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.102

0.114

2.60

2.89

L

0.090 BSC

2.29 BSC

R

0.180

0.215

4.57

5.45

S

0.025

0.040

0.63

1.01

U

0.020

−−−

0.51

−−−

V

0.035

0.050

0.89

1.27

Z

0.155

−−−

3.93

−−−

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

12

3

4

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

mm

inches

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

STYLE 4:

PIN 1. CATHODE

2. ANODE

3. GATE

4. ANODE

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