SN74AVCH16T245

SCES587D – AUGUST 2004 – REVISED NOVEMBER 2015

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7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

1.2

3.6

V

Supply voltage

1.2

3.6

V

1.2 V to 1.95 V

High-level

1.95 V to 2.7 V

1.6

V

input voltage

2.7 V to 3.6 V

2

1.2 V to 1.95 V

Low-level

1.95 V to 2.7 V

0.7

V

input voltage

2.7 V to 3.6 V

0.8

1.2 V to 1.95 V

High-level

DIR

1.95 V to 2.7 V

1.6

V

input voltage

(5)

2.7 V to 3.6 V

2

1.2 V to 1.95 V

Low-level

DIR

1.95 V to 2.7 V

0.7

V

input voltage

(5)

2.7 V to 3.6 V

0.8

Input voltage

0

3.6

V

Active state

0

Output voltage

V

Tri-State

0

3.6

1.2 V

–3

1.4 V to 1.6 V

–6

High-level output current

1.65 V to 1.95 V

–8

mA

2.3 V to 2.7 V

–9

3 V to 3.6 V

–12

1.2 V

3

1.4 V to 1.6 V

6

Low-level output current

1.65 V to 1.95 V

8

mA

2.3 V to 2.7 V

9

3 V to 3.6 V

12

Δt/Δv

Input transition rise or fall rate

5

ns/V

Operating free-air temperature

–40

85

°C

(1)

(2)

(3)

Implications of Slow or Floating CMOS Inputs, SCBA004.

(4)

(5)

7.4 Thermal Information

SN74AVCH16T245

TSSOP

TVSOP

ZQL/GQL

UNIT

(DGG)

(DGV)

(BGA MICROSTAR JUNIOR)

48 PINS

48 PINS

56 PINS

Junction-to-ambient thermal resistance

82.5

69.9

64.6

°C/W

Junction-to-case (top) thermal resistance

34.2

23.9

16.6

°C/W

Junction-to-board thermal resistance

45.1

36.6

30.8

°C/W

Junction-to-top characterization parameter

2.7

1.7

0.9

°C/W

Junction-to-board characterization parameter

44.6

36.2

64.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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