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HYB39L256160AC-7.5 Datasheet(PDF) 5 Page - Infineon Technologies AG

Part # HYB39L256160AC-7.5
Description  BJAWBMSpecialty DRAMs Mobile-RAM
Download  6 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

HYB39L256160AC-7.5 Datasheet(HTML) 5 Page - Infineon Technologies AG

  HYB39L256160AC-7.5 Datasheet HTML 1Page - Infineon Technologies AG HYB39L256160AC-7.5 Datasheet HTML 2Page - Infineon Technologies AG HYB39L256160AC-7.5 Datasheet HTML 3Page - Infineon Technologies AG HYB39L256160AC-7.5 Datasheet HTML 4Page - Infineon Technologies AG HYB39L256160AC-7.5 Datasheet HTML 5Page - Infineon Technologies AG HYB39L256160AC-7.5 Datasheet HTML 6Page - Infineon Technologies AG  
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O
OC
CT
TS
S ((O
On
n--C
Ch
hiip
p T
Te
em
mp
pe
erra
attu
urre
e S
Se
en
nsso
orr))::
The built-in temperature sensor adapts the refresh
rate to the actual junction temperature of the chip
without draining any CPU power. (Note: with
standard DRAMs, the refresh rate is set to work at
the max. temperature.)
T
TC
CS
SR
R ((T
Te
em
mp
pe
erra
attu
urre
e--C
Co
om
mp
pe
en
nssa
atte
ed
d S
Se
ellff--R
Re
effrre
essh
h))::
Same as OCTS but externally triggered
CPU power required
Speed: 133 MHz CAS Latency: 3-3-3
Density
Part number
Temp.
Power
Power
# of
OCTS TCSR PASR DPD
DS
GREEN
Package
range
supply core
supply I/O
banks
product
128 Mb
HYB39L128160AT-7.5
0 - 70°C
3.3 V
3.3 V
4
–
–
–
–
–
–
TSOP-54
8 M x 16
HYB39L128160AC-7.5
0 - 70°C
3.3 V
3.3 V
4
–
–
–
–
–
–
FBGA-54
HYB25L128160AC-7.5
0 - 70°C
2.5 V
2.5 V / 1.8 V
4
–
X
X
X
–
–
FBGA-54
HYE25L128160AC-7.5
-25 - 85°C
2.5 V
2.5 V / 1.8 V
4
–
X
X
X
–
–
FBGA-54
NEW!
HYB18L128160BF-7.5
0 - 70°C
1.8 V
1.8 V
4
X
–
X
X
X
X
FBGA-54
NEW!
HYE18L128160BF-7.5
-25 - 85°C
1.8 V
1.8 V
4
X
–
X
X
X
X
FBGA-54
NEW!
HYB18L128160BC-7.5
0 - 70°C
1.8 V
1.8 V
4
X
–
X
X
X
–
FBGA-54
NEW!
HYE18L128160BC-7.5
-25 - 85°C
1.8 V
1.8 V
4
X
–
X
X
X
–
FBGA-54
256 Mb
HYB39L256160AT-7.5
0 - 70°C
3.3 V
3.3 V
4
–
–
–
–
–
–
TSOP-54
16 M x 16
HYB39L256160AC-7.5
0 - 70°C
3.3 V
3.3 V
4
–
–
–
–
–
–
FBGA-54
HYB25L256160AC-7.5
0 - 70°C
2.5 V
2.5 V / 1.8 V
4
X
X
X
X
–
–
FBGA-54
HYE25L256160AC-7.5
-25 - 85°C
2.5 V
2.5 V / 1.8 V
4
X
X
X
X
–
–
FBGA-54
HYB25L256160AF-7.5
0 - 70°C
3.3 V
3.3 V or
4
X
X
X
X
–
X
FBGA-54
or 2.5 V
2.5 V / 1.8 V
HYE25L256160AF-7.5
-25 - 85°C
3.3 V
3.3 V or
4
X
X
X
X
–
X
FBGA-54
or 2.5 V
2.5 V / 1.8 V
NEW!
HYB18L256160BF-7.5
0 - 70°C
1.8 V
1.8 V
4
X
–
X
X
X
X
FBGA-54
NEW!
HYE18L256160BF-7.5
-25 - 85°C
1.8 V
1.8 V
4
X
–
X
X
X
X
FBGA-54
NEW!
HYB18L256160BC-7.5
0 - 70°C
1.8 V
1.8 V
4
X
–
X
X
X
–
FBGA-54
NEW!
HYE18L256160BC-7.5
-25 - 85°C
1.8 V
1.8 V
4
X
–
X
X
X
–
FBGA-54
512 Mb,Dual
HYB25L512160AC-7.5
3.3 V
3.3 V or
4
X
–
X
X
–
–
FBGA-54
16 M x 16
0 - 70°C
or 2.5 V
2.5 V / 1.8 V
Product Portfolio
P
PA
AS
SR
R ((P
Pa
arrttiia
all A
Arrrra
ay
y S
Se
ellff--R
Re
effrre
essh
h))::
Allows user to select volume of memory needed to
further reduce power consumption
Adjustable from all 4 banks to 1/16 array
D
DP
PD
D ((D
De
ee
ep
p P
Po
ow
we
err--D
Do
ow
wn
n))::
Maximum power consumption reduction by cutting
off power supply to Mobile-RAM
Data is not retained
D
DS
S ((S
Se
elle
ecctta
ab
blle
e D
Drriiv
ve
e S
Sttrre
en
ng
gtth
h))::
Can be adjusted to reflect bus load, e.g. half
strength for point-to-point and full strength for
module applications


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