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HYB39L256160AC-7.5 Datasheet(PDF) 5 Page - Infineon Technologies AG |
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HYB39L256160AC-7.5 Datasheet(HTML) 5 Page - Infineon Technologies AG |
5 / 6 page O OC CT TS S ((O On n--C Ch hiip p T Te em mp pe erra attu urre e S Se en nsso orr)):: The built-in temperature sensor adapts the refresh rate to the actual junction temperature of the chip without draining any CPU power. (Note: with standard DRAMs, the refresh rate is set to work at the max. temperature.) T TC CS SR R ((T Te em mp pe erra attu urre e--C Co om mp pe en nssa atte ed d S Se ellff--R Re effrre essh h)):: Same as OCTS but externally triggered CPU power required Speed: 133 MHz CAS Latency: 3-3-3 Density Part number Temp. Power Power # of OCTS TCSR PASR DPD DS GREEN Package range supply core supply I/O banks product 128 Mb HYB39L128160AT-7.5 0 - 70°C 3.3 V 3.3 V 4 – – – – – – TSOP-54 8 M x 16 HYB39L128160AC-7.5 0 - 70°C 3.3 V 3.3 V 4 – – – – – – FBGA-54 HYB25L128160AC-7.5 0 - 70°C 2.5 V 2.5 V / 1.8 V 4 – X X X – – FBGA-54 HYE25L128160AC-7.5 -25 - 85°C 2.5 V 2.5 V / 1.8 V 4 – X X X – – FBGA-54 NEW! HYB18L128160BF-7.5 0 - 70°C 1.8 V 1.8 V 4 X – X X X X FBGA-54 NEW! HYE18L128160BF-7.5 -25 - 85°C 1.8 V 1.8 V 4 X – X X X X FBGA-54 NEW! HYB18L128160BC-7.5 0 - 70°C 1.8 V 1.8 V 4 X – X X X – FBGA-54 NEW! HYE18L128160BC-7.5 -25 - 85°C 1.8 V 1.8 V 4 X – X X X – FBGA-54 256 Mb HYB39L256160AT-7.5 0 - 70°C 3.3 V 3.3 V 4 – – – – – – TSOP-54 16 M x 16 HYB39L256160AC-7.5 0 - 70°C 3.3 V 3.3 V 4 – – – – – – FBGA-54 HYB25L256160AC-7.5 0 - 70°C 2.5 V 2.5 V / 1.8 V 4 X X X X – – FBGA-54 HYE25L256160AC-7.5 -25 - 85°C 2.5 V 2.5 V / 1.8 V 4 X X X X – – FBGA-54 HYB25L256160AF-7.5 0 - 70°C 3.3 V 3.3 V or 4 X X X X – X FBGA-54 or 2.5 V 2.5 V / 1.8 V HYE25L256160AF-7.5 -25 - 85°C 3.3 V 3.3 V or 4 X X X X – X FBGA-54 or 2.5 V 2.5 V / 1.8 V NEW! HYB18L256160BF-7.5 0 - 70°C 1.8 V 1.8 V 4 X – X X X X FBGA-54 NEW! HYE18L256160BF-7.5 -25 - 85°C 1.8 V 1.8 V 4 X – X X X X FBGA-54 NEW! HYB18L256160BC-7.5 0 - 70°C 1.8 V 1.8 V 4 X – X X X – FBGA-54 NEW! HYE18L256160BC-7.5 -25 - 85°C 1.8 V 1.8 V 4 X – X X X – FBGA-54 512 Mb,Dual HYB25L512160AC-7.5 3.3 V 3.3 V or 4 X – X X – – FBGA-54 16 M x 16 0 - 70°C or 2.5 V 2.5 V / 1.8 V Product Portfolio P PA AS SR R ((P Pa arrttiia all A Arrrra ay y S Se ellff--R Re effrre essh h)):: Allows user to select volume of memory needed to further reduce power consumption Adjustable from all 4 banks to 1/16 array D DP PD D ((D De ee ep p P Po ow we err--D Do ow wn n)):: Maximum power consumption reduction by cutting off power supply to Mobile-RAM Data is not retained D DS S ((S Se elle ecctta ab blle e D Drriiv ve e S Sttrre en ng gtth h)):: Can be adjusted to reflect bus load, e.g. half strength for point-to-point and full strength for module applications |
Similar Part No. - HYB39L256160AC-7.5 |
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Similar Description - HYB39L256160AC-7.5 |
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