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HYB25L128160AC-7.5 Datasheet(PDF) 2 Page - Infineon Technologies AG |
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HYB25L128160AC-7.5 Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 6 page M obile-RAM – E xtended B attery Lifetime for H andhelds AS ONE OF THE W ORLD’S T O P THREE memory companies, Infineon offers a wide portfolio of leading-edge Mobile-RAM devices (low-power SDRAMs) targeted specifically at: PDAs Cellphones (smart and feature phones) Digital cameras MP3 players INFINEON’S MOBILE-RAM product line combines Ultra low-power consumption for battery-powered systems with Extra compact chip-scale packages for space-constrained applications INFINEON’S MOBILE-RAM cuts power consumption by up to 80 % (depending on operating conditions and system design) – thanks to its latest memory technology, low operating voltage (1.8 V) and its unique, integrated power management features. MOBILE-RAM DE VICES come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.2 to 1 mm. |
Similar Part No. - HYB25L128160AC-7.5 |
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Similar Description - HYB25L128160AC-7.5 |
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