M obile-RAM – E xtended B attery

Lifetime for H andhelds

AS ONE OF THE W ORLD’S T O P THREE memory companies, Infineon offers a wide portfolio of

leading-edge Mobile-RAM devices (low-power SDRAMs) targeted specifically at:

PDAs

Cellphones (smart and feature phones)

Digital cameras

MP3 players

INFINEON’S MOBILE-RAM product line combines

Ultra low-power consumption for battery-powered systems with

Extra compact chip-scale packages for space-constrained applications

INFINEON’S MOBILE-RAM cuts power consumption by up to 80 % (depending on operating conditions

and system design) – thanks to its latest memory technology, low operating voltage (1.8 V) and its unique, integrated

power management features.

MOBILE-RAM DE VICES come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage

Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product

generation further improves form factor by reducing package heights from 1.2 to 1 mm.