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STTH60SW03CW Datasheet(PDF) 6 Page - STMicroelectronics |
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STTH60SW03CW Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 9 page Package information STTH60SW03C 6/9 DocID026582 Rev 1 2 Package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) • Recommended torque: TO-247 0.5 to 1.0 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. TO-247 dimension definitions E L2 S D c A1 BACK VIEW Heat-sink plane L1 L b1 b2 b A e 1 1 2 2 3 3 ∅R ∅P |
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