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HYB18T256800AF-5 Datasheet(PDF) 7 Page - Infineon Technologies AG |
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HYB18T256800AF-5 Datasheet(HTML) 7 Page - Infineon Technologies AG |
7 / 90 page HYB18T256400/800/160AF 256Mb DDR2 SDRAM INFINEON Technologies Page 7 Rev. 1.02 May 2004 1.4.2 Package Pinout for x8 components, 60 pins, FBGA Package (top view) 1 2 3 7 8 9 VDD NU, RDQS VSS A VSSQ DQS VDDQ DQ6 VSSQ DM, RDQS B DQS VSSQ DQ7 VDDQ DQ1 VDDQ C VDDQ DQ0 VDDQ DQ4 VSSQ DQ3 D DQ2 VSSQ DQ5 VDDL VREF VSS E VSSDL CK VDD CKE WE F RAS CK ODT RFU BA0 BA1 G CAS CS A10 A1 H A2 A0 VDD VSS A3 A5 J A6 A4 A7 A9 K A11 A8 VSS VDD A12 NC,(A14) L NC,(A15) NC,(A13) Notes: 1) RDQS / RDQS are enabled by EMRS(1) command. 2) If RDQS / RDQS is enabled, the DM function is disabled 3) When enabled, RDQS & RDQS are used as strobe signals during reads. 4) VDDL and VSSDL are power and ground for the DLL. They are isolated on the device from VDD, VDDQ, VSS and VSSQ. 5) NC,(A13), NC,(A14) and NC,(A15) are additional address pins for future generation DRAMs and are not connected on this component. 6) Ball position G1 “RFU” will be used for BA2 on 1Gbit memory densities and higher |
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