STM32F746BG datasheet(8/227 Pages) STMICROELECTRONICS

Part #	STM32F746BG

Description	Up to 168 I/O ports with interrupt capability

Download	227 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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8 / 227 page

List of tables

STM32F745xx STM32F746xx

8/227

DocID027590 Rev 4

Table 94.

Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 175

Table 95.

Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 176

Table 96.

Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

Table 97.

Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Table 98.

Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 181

Table 99.

Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

Table 100. Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 185

Table 101. Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . 185

Table 102. SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

Table 103. LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

Table 104. SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 105. LPSDR SDRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Table 106. Quad-SPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Table 107. Quad-SPI characteristics in DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190

Table 108. DCMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

Table 109. LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192

Table 110. Dynamic characteristics: SD / MMC characteristics, VDD=2.7V to 3.6V . . . . . . . . . . . . . 195

Table 111. Dynamic characteristics: eMMC characteristics, VDD=1.71V to 1.9V . . . . . . . . . . . . . . . 195

Table 112. LQPF100, 14 x 14 mm 100-pin low-profile quad flat package mechanical data. . . . . . . . 197

Table 113. TFBGA100, 8 x 8 × 0.8 mm thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199

Table 114. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 201

Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202

Table 116. WLCSP143 recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204

Table 117. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205

Table 118. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208

Table 119. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

Table 120. UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216

Table 121. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) . . . . . . . . . . . . . 217

Table 122. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219

Table 123. TFBGA216 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 220

Table 124. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222

Table 125. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223

Table 126. Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . 224

Table 127. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225

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