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P82B96PWR Datasheet(PDF) 5 Page - Texas Instruments |
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P82B96PWR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 34 page P82B96 www.ti.com SCPS144C – MAY 2006 – REVISED MAY 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage on VCC pin –0.3 18 V Sx or Sy (SDA or SCL) –0.3 18 VI Voltage on buffered input V Rx or Ry –0.3 18 Sx or Sy (SDA or SCL) –0.3 18 VO Voltage on buffered output V Tx or Ty –0.3 18 Sx or Sy 250 IO Continuous output current mA Tx or Ty 250 ICC Continuous current through VCC or GND 250 mA TA Operating free-air temperature –40 85 °C Tstg Storage temperature –55 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3500 Charged-Device Model (CDM), per JEDEC specification JESD22- ±1000 V(ESD) Electrostatic discharge V C101(2) Machine Model (MM), per JEDEC specification JESD22-A115-A ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage 2 15 V Sx, Sy VSx, VSy = 1 V, VRx, VRy ≤ 0.42 V 3 IOL Low-level output current mA Tx, Ty VSx, VSy = 0.4 V, VTx, VTy = 0.4 V 30 Sx, Sy VTx, VTy = 0.4 V 15 VIOmax Maximum input/output voltage level V Tx, Ty VSx, VSy = 0.4 V 15 VILdiff Low-level input voltage difference Sx, Sy 0.4 V TA Operating free-air temperature –40 85 °C 7.4 Thermal Information P82B96 THERMAL METRIC(1) D (SOIC) DGK (VSSOP) P (PDIP) PW (TSSOP) UNIT 8 PINS 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 109.1 174.3 53.5 173.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.6 63 44.4 57.6 °C/W RθJB Junction-to-board thermal resistance 48.6 94.2 30.6 101.8 °C/W ψJT Junction-to-top characterization parameter 19.6 8.1 22.9 5.3 °C/W ψJB Junction-to-board characterization parameter 48.2 92.8 30.5 100.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: P82B96 |
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