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ESDA6V1SC6Y Datasheet(PDF) 10 Page - STMicroelectronics |
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ESDA6V1SC6Y Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 12 page Recommendation on PCB assembly ESDASCY 10/12 Doc ID 022084 Rev 1 5.3 PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.4 Reflow profile Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -6°C/s 240-245 °C 2 - 3 °C/s Temperature (°C) -2 °C/s -3 °C/s Time (s) 0.9 °C/s 60 sec (90 max) |
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