AMC1304L05, AMC1304L25, AMC1304M05, AMC1304M25

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SBAS655C – SEPTEMBER 2014 – REVISED SEPTEMBER 2015

7.8 Regulatory Information

VDE

UL, cUL

Recognized under UL1577 component recognition and CSA

Certified according to DIN V VDE V 0884-10

component acceptance NO 5 programs

File number: 40040142

File number: E181974

7.9 IEC Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A

failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient

power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.

The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings

table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware

determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of

a device installed in the JESD51-7, High-K Test Board for Leaded Surface-Mount Packages. The power is the recommended

maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the

junction-to-air thermal resistance.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Safety input, output, or supply current

90

mA

Maximum case temperature

150

°C

7.10 IEC 61000-4-5 Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Surge immunity

1.2-µs rise time and 50-

μs fall time, voltage surge

±10000

V

7.11 Isolation Characteristics

PARAMETER

TEST CONDITIONS

AMC1304

UNIT

AC voltage (bipolar or unipolar)

1000

Maximum working insulation voltage

DC voltage

1500

t = 1 s (100% production test),

Partial discharge test voltage

3977

partial discharge < 5 pC

t = 60 s (qualification test)

7000

Transient overvoltage

t = 1 s (100% production test)

8400

Isolation resistance

Ω

7.12 Package Characteristics

(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (clearance)

Shortest pin to pin distance through air

8

mm

Minimum external tracking

Shortest pin-to-pin distance across the package

L(I02)

8

mm

(creepage)

surface

Tracking resistance

IEC: DIN EN 60112 (VDE 0303-11) and UL:

CTI

600

V

(comparative tracking index)

ASTM D3638-12

Minimum internal gap

Distance through the double insulation

0.027

mm

(internal clearance)

(2 × 0.0135 mm)

PD

Pollution degree

2

Degrees

Barrier capacitance input to

1.2

pF

output

(1)

Creepage and clearance requirements must be applied according to the specific equipment isolation standards of a specific application.

Care must be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the

isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal according to

the measurement techniques described in the Isolation Glossary section. Techniques such as inserting grooves or ribs on the PCB are

used to help increase these specifications.

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