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ADC0804LCWMX/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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ADC0804LCWMX/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
4 / 56 page ADC0801, ADC0802, ADC0803, ADC0804, ADC0805 SNOSBI1C – NOVEMBER 2009 – REVISED JUNE 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage (VCC) (3) 6.5 V Logic control inputs –0.3 18 Voltage V At other input and outputs –0.3 (VCC +0.3) Dual-In-Line Package (plastic 260 Lead Temperature Dual-In-Line Package (ceramic) 300 (Soldering, 10 Surface Mount Package Vapor Phase (60 seconds) 215 °C seconds) Infrared (15 seconds) 220 Storage Temperature –65 150 Package Dissipation at TA = 25°C 875 mW (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the Sales Office/Distributors for availability and specifications. (3) A Zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±800 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC 4.5 5 5.5 V Analog Input Voltage GND – 0.05 VCC + 0.05 VDC 6.4 Thermal Information ADC080x ADC0802, ADC0804 THERMAL METRIC(1) UNIT NFH (PDIP) DW (SOIC) 20 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 38.5 63.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 23.4 27.2 °C/W RθJB Junction-to-board thermal resistance 19.5 31.8 °C/W ψJT Junction-to-top characterization parameter 8.7 5.7 °C/W ψJB Junction-to-board characterization parameter 19.4 31.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 |
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