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LMP92066PWPR Datasheet(PDF) 5 Page - Texas Instruments |
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LMP92066PWPR Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 63 page  LMP92066 www.ti.com SNAS634B – MARCH 2014 – REVISED JANUARY 2016 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD –0.3 5.5 VDDB –0.3 5.5 VIO Supply voltage with respect to GNDA –0.3 5.5 V VSSB –5.5 0.3 GNDD –0.3 0.3 VDDB to VSSB –0.3 5.5 V Any other pins to GNDA –0.3 5.5 DAC output current 10 mA Current at all other pins 5 Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operational temperature –40 125 °C Specification temperature –25 120 DAC output load capacitance 8 12 µF VDD Supply voltage range (VDD) 4.75 5.25 VIO Digital I/O supply voltage 1.65 3.3 V LDMOS mode VSSB = GNDA 5 VDDB–VSSB GaN mode VSSB = –5 V 5 7.4 Thermal Information PWP (HTSSOP) THERMAL METRIC(1) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 38.2 RθJC(top) Junction-to-case (top) thermal resistance 21.3 RθJB Junction-to-board thermal resistance 15.1 °C/W ψJT Junction-to-top characterization parameter 0.5 ψJB Junction-to-board characterization parameter 14.9 RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LMP92066 |
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