DLP9500

DLPS025C – AUGUST 2012 – REVISED SEPTEMBER 2015

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Table of Contents

8.3

Feature Description................................................. 26

1

Features .................................................................. 1

8.4

Device Functional Modes........................................ 32

2

Applications ........................................................... 1

8.5

Window Characteristics and Optics ....................... 34

3

Description ............................................................. 1

8.6

Micromirror Array Temperature Calculation............ 35

4

Revision History..................................................... 2

8.7

Micromirror Landed-On and Landed-Off Duty

5

Description (continued)......................................... 4

Cycle ........................................................................ 37

6

Pin Configuration and Functions ......................... 4

9

Application and Implementation ........................ 39

7

Specifications....................................................... 13

9.1

Application Information............................................ 39

7.1

Absolute Maximum Ratings .................................... 13

9.2

Typical Application ................................................. 40

7.2

Storage Conditions.................................................. 13

10

Power Supply Recommendations ..................... 42

7.3

ESD Ratings............................................................ 13

10.1

Power-Up Sequence (Handled by the DLPC410) 42

7.4

Recommended Operating Conditions ..................... 14

10.2

DMD Power-Up and Power-Down Procedures..... 42

7.5

Thermal Information ................................................ 15

11

Layout................................................................... 43

7.6

Electrical Characteristics......................................... 15

11.1

Layout Guidelines ................................................. 43

7.7

LVDS Timing Requirements ................................... 16

11.2

Layout Example .................................................... 45

7.8

LVDS Waveform Requirements .............................. 17

12

Device and Documentation Support ................. 46

7.9

Serial Control Bus Timing Requirements................ 18

12.1

Device Support .................................................... 46

7.10

Systems Mounting Interface Loads....................... 19

12.2

Documentation Support ........................................ 46

7.11

Micromirror Array Physical Characteristics ........... 20

12.3

Community Resources.......................................... 46

7.12

Micromirror Array Optical Characteristics ............. 21

12.4

Trademarks ........................................................... 47

7.13

Window Characteristics......................................... 22

12.5

Electrostatic Discharge Caution ............................ 47

7.14

Chipset Component Usage Specification ............. 23

12.6

Glossary ................................................................ 47

8

Detailed Description ............................................ 24

13

Mechanical, Packaging, and Orderable

8.1

Overview ................................................................. 24

Information ........................................................... 47

8.2

Functional Block Diagram ....................................... 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (July 2013) to Revision C

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Minor wording changes in Features and Description sections ............................................................................................... 1

•

Changed name of Micromirror clocking pulse reset ............................................................................................................. 11

•

Changed ESD Ratings table to match new standard ........................................................................................................... 13

•

Adjusted recommended power density conditions ............................................................................................................... 14

•

Changed thermal test points to match new test point diagram ............................................................................................ 14

•

Replaced Figure 3. ............................................................................................................................................................... 18

•

Changed units from lbs to N................................................................................................................................................. 19

•

Added Max Recommended DMD Temperature – Derating Curve....................................................................................... 22

•

Added explanation for the15 MBRST lines to the DLP9500 from each DLPA200............................................................... 26

•

Changed Thermal Test Point Location graphic .................................................................................................................... 35

•

Added program interface to system interface list ................................................................................................................. 41

•

Corrected number of banks of DMD mirrors to 15 ............................................................................................................... 41

•

Removed link to DLP Discovery 4100 chipset datasheet..................................................................................................... 46

•

Added Community Resources ............................................................................................................................................. 46

2

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