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LMX2492RTWT Datasheet(PDF) 4 Page - Texas Instruments |
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LMX2492RTWT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 42 page LMX2492, LMX2492-Q1 SNAS624B – MARCH 2014 – REVISED MAY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Vcp Supply voltage for charge pump Vcc 5.5 V CPout Charge pump output pin -0.3 Vcp V Vcc All Vcc pins -0.3 3.6 V Others All other I/O pins -0.3 Vcc + 0.3 V TSolder Lead temperature (solder 4 seconds) 260 °C TJunction Junction temperature 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Storage Conditions applicable before the DMD is installed in the final product MIN MAX UNIT Tstg DMD storage temperature -65 150 °C MSL Moisture sensitivity level 3 n/a 7.3 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) PARAMETER DEVICE MIN NOM MAX UNIT Vcc PLL supply voltage 3.15 3.3 3.45 V Vcp Charge pump supply voltage Vcc 5.25 V LMX2492 -40 85 TA Ambient temperature °C LMX2492-Q1 -40 125 LMX2492 -40 125 TJ Junction temperature °C LMX2492-Q1 -40 135 7.5 Thermal Information LMX2492 RTW THERMAL METRIC(1) (WQFN ) UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 39.4 RθJC Junction-to-case thermal resistance 7.1 °C/W ψJB Junction-to-board characterization parameter 20 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: LMX2492 LMX2492-Q1 |
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