LMX2492, LMX2492-Q1

SNAS624B – MARCH 2014 – REVISED MAY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Vcp

Supply voltage for charge pump

Vcc

5.5

V

CPout

Charge pump output pin

-0.3

Vcp

V

Vcc

All Vcc pins

-0.3

3.6

V

Others

All other I/O pins

-0.3

Vcc + 0.3

V

Lead temperature (solder 4 seconds)

260

°C

Junction temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Storage Conditions

applicable before the DMD is installed in the final product

MIN

MAX

UNIT

DMD storage temperature

-65

150

°C

MSL

Moisture sensitivity level

3

n/a

7.3 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

PARAMETER

DEVICE

MIN

NOM

MAX

UNIT

Vcc

PLL supply voltage

3.15

3.3

3.45

V

Vcp

Charge pump supply voltage

Vcc

5.25

V

LMX2492

-40

85

Ambient temperature

°C

LMX2492-Q1

-40

125

LMX2492

-40

125

Junction temperature

°C

LMX2492-Q1

-40

135

7.5 Thermal Information

LMX2492 RTW

(WQFN )

UNIT

24 PINS

Junction-to-ambient thermal resistance

39.4

Junction-to-case thermal resistance

7.1

°C/W

Junction-to-board characterization parameter

20

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2014–2015, Texas Instruments Incorporated

Product Folder Links: LMX2492 LMX2492-Q1