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LMK04803BISQX Datasheet(PDF) 6 Page - Texas Instruments |
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LMK04803BISQX Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 139 page  LMK04803, LMK04805, LMK04806, LMK04808 SNAS489K – MARCH 2011 – REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) (3) over operating free-air temperature range (unless otherwise noted) (4) MIN MAX UNIT VCC Supply Voltage (5) –0.3 3.6 V (VCC + VIN Input Voltage –0.3 V 0.3) TL Lead Temperature (solder 4 seconds) +260 °C TJ Junction Temperature 150 °C Differential Input Current (CLKinX/X*, IIN ± 5 mA OSCin/OSCin*, FBCLKin/FBCLKin*, Fin/Fin*) MSL Moisture Sensitivity Level 3 Tstg Storage temperature range -65 150 °C (1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only to the test conditions listed. (2) Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These are absolute stress ratings only. Functional operation of the device is only implied at these or any other conditions in excess of those given in the operation sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. (3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (5) Never to exceed 3.6 V. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Machine model (MM) ±150 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±750 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT TJ Junction Temperature 125 °C TA Ambient Temperature VCC = 3.3 V -40 25 85 °C VCC Supply Voltage 3.15 3.3 3.45 V 6 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808 |
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