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SI53340 Datasheet(PDF) 6 Page - Silicon Laboratories |
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SI53340 Datasheet(HTML) 6 Page - Silicon Laboratories |
6 / 23 page Si53340 6 Rev. 1.0 Table 8. Thermal Conditions Parameter Symbol Test Condition Value Unit Thermal Resistance, Junction to Ambient JA Still air 57.6 °C/W Thermal Resistance, Junction to Case JC Still air 41.5 °C/W Table 9. Absolute Maximum Ratings Parameter Symbol Test Condition Min Typ Max Unit Storage Temperature TS –55 — 150 C Supply Voltage VDD –0.5 — 3.8 V Input Voltage VIN –0.5 — VDD+ 0.3 V Output Voltage VOUT —— VDD+ 0.3 V ESD Sensitivity HBM HBM, 100 pF, 1.5 k — — 2000 V ESD Sensitivity CDM — — 500 V Peak Soldering Reflow Temperature TPEAK Pb-Free; Solder reflow profile per JEDEC J-STD-020 — — 260 C Maximum Junction Temperature TJ — — 125 C Note: Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. |
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