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23026HT

Rev. 1.6

1 of 1

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

FOR TEST SOCKET RECEPTACLES, SEE DATA SHEET 10003

DO NOT USE THIS SOCKET IN A BURN-IN OVEN WITH CONTACTS IN OPEN

POSITION, AS IT WILL DAMAGE THE SOCKET

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.

SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE

FURNISHED, DEPENDING ON QUANTITY.

ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS

WITHOUT NOTICE

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE

CONSIDERED UNCONTROLLED

INTERPOSER

Cross Section

Column Array

Elastomer Matrix Compliant Buttons

Ag Particles

KEY PERFORMANCE ELEMENTS – Series AR4HT

•Ariesuniqueuniversalsocketingsystemallowsthesockettobeeasilyconfigured

foranypackage,onanypitch(ormultiplepitch)from0.2mmorgreater,inany

configuration,withlittleornotoolingchargeorextralead-time.

•ForTest&Burn-InofCSP,µBGA,Bump-Array,QFN,QFP,MLF,DFN,SSOP,

TSSOP,TSOP,SOP,SOIC,LGA,LCC,PLCC,TOandanySMTpackagestylemade.

AlsocanbecompatiblewithPGApackageddevices.

•QuickandEasyInterposerReplacementSystem:thecompleteinterposercanbe

removedandanewone(interposer)andbeinsertedquicklyandeasily.This

savestimeandmoneyinyourtestsetup.

•High-Temperature200°C(high-frequencybandwidth,lowinductance,andhigh-

currentapplicationsinareliableanddurablesockethousing).

•ExcellentCompliance(shorterthanotherlow-profilecontacts,enablesreliable

ATEtestingandburn-in).Excellentchoiceforlow-costhandtestapplications.

•ItisNOTacheapconductiverubbersheet

•ItisNOTaprototypeoracopy

•ItISacost-effective,lowprofilecontactstructureengineeredwithspecific

materialsandfeaturestoprovideelectricalandmechanicaladvantagesforhigh

performanceapplications

•ItISaninnovative,protected,validatedandreleasedproductwithcapacityand

qualitycontrolavailabletomeetexistingandemergingcustomerneeds

MECHANICAL

•CONTACTLENGTH(compressed):0.45mm

•PITCH:Releasedto<0.4mm–MixedPitchAvailable

•PACKAGES:BGA,LGA,QFN,DFN,CSP,POP–FullandPartialArraysAvailable

•INTERPOSERMATERIALS:AgParticlesinSiliconeElastomerwithPolyimide

Core(patented)

•COMPLIANCERANGE/TRAVEL:Upto0.23mm

•CONTACTFORCE/LEAD(initial):20-30grams/lead

•OPERATINGTEMPERATURE:−55°Cto200°C

(influencedbyintroductionofbiastotheICandtheplating

ofICleadswillimpactthedegradationofthecontactperfor-

mance)

ELECTRICAL (0.5mm pitch)

•BANDWIDTH(frequencyresponse):-1dBat>40GHz

•SELF-INDUCTANCE:0.10nH

•MUTUALINDUCTANCE:0.02nH

•CAPACITANCETOGROUND:0.14pF

•MUTUALCAPACITANCE:0.01pF

•CONTACTRESISTANCE(initial):<25mΩ

•CURRENTRATING:4ampsat14°Cheatrise

High-Temp 200°C Test & Burn-In Sockets for

BGA, LGA, QFN, MLCC, and Bumped Die Devices

ORDERING INFORMATION

This material can be ordered with

ANY Aries CSP/BGA Sockets