LMX2430, LMX2433, LMX2434

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SNAS187D – FEBRUARY 2003 – REVISED JANUARY 2016

7.3 Thermal Information

LMX243x

NPE (ULGA)

PW (TSSOP)

UNIT

20 PINS

20 PINS

Junction-to-ambient thermal resistance

80.9

111.5

°C/W

Junction-to-case (top) thermal resistance

22.5

44.9

°C/W

Junction-to-board thermal resistance

40

63.5

°C/W

Junction-to-top characterization parameter

0.2

6.1

°C/W

Junction-to-board characterization parameter

40

62.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

LMX2430

CLK, DATA and LE = 0 V

2.8

3.6

mA

Power supply current,

OSCin = GND

LMX2433

3.2

4.4

mA

RF

RF_PD Bit = 0

synthesizer

IF_PD Bit = 1

LMX2434

4.6

6.2

mA

RF_P Bit = 0

LMX2430

CLK, DATA and LE = 0 V

1.4

2

mA

Power supply current,

OSCin = GND

LMX2433

2

2.8

mA

IF

RF_PD Bit = 1

synthesizer

IF_PD Bit = 0

LMX2434

2.4

3.5

mA

IF_P Bit = 0

EN, ENosc, CLK, DATA

Power-down current

10

μA

and LE = 0 V

RF SYNTHESIZER PARAMETERS

RF_P Bit = 0

250

2500

MHz

LMX2430

RF_P Bit = 1

250

3000

MHz

RF operating

RF_P Bit = 0

500

3000

MHz

frequency

LMX2433

RF_P Bit = 1

500

3600

MHz

LMX2434

RF_P Bit = 0 or 1

1000

5000

MHz

24

262,151

N divider range

48

524,287

96

524,287

RF R divider range

3

32,767

RF phase detector frequency

10

MHz

LMX2430 / 33

−15

0

dBm

2.25 V

(2)

RF input sensitivity

LMX2434

−12

0

dBm

2.35 V

(2)

–1

mA

RF charge-pump output source current

Source

–4

mA

1

mA

RF charge-pump output sink current

Sink

4

mA

(1)

Some of the values in this range are illegal divide ratios (B < A). To obtain continuous legal division, the Minimum Divide Ratio must be

calculated. Use N

≥ P * (P−1), where P is the value of the prescaler selected.

(2)

Refer to LMX243x FinRF Sensitivity Test Set-Up.

(3)

Refer to LMX243x Charge Pump Test Set-Up.

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