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AP22800HB-7 Datasheet(PDF) 11 Page - Diodes Incorporated |
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AP22800HB-7 Datasheet(HTML) 11 Page - Diodes Incorporated |
11 / 14 page AP22800 Document number: DS36046 Rev. 3 - 2 11 of 14 www.diodes.com January 2015 © Diodes Incorporated AP22800 Board Layout and Thermal Considerations Due to the high current capacity of the load switch, PCB layout needs to ensure good thermal distribution during operation. The top and bottom of AP22800EV1, the evaluation board for the AP22800, can be seen below. Figure 1. PCB Copper Layout & Silk Screen – Top Figure 2. PCB Copper Layout & Silk Screen – Bottom Thermal vias are used directly underneath the chip to help distribute the heat from the device. The ground plane on the underside of the board effectively acts as a large heatsink. The widths of the tracks carrying VIN and VOUT are kept wide. Vias are also distributed around the board to aid thermal conduction and to ensure a consistent potential, particularly around the ground connections of the capacitors. All capacitors used are located as close as possible to the AP22800 to minimize any parasitic effects. The maximum junction temperature of the AP22800 is +125°C. To ensure that this is not exceeded, the following equation can be used to give an approximation of junction temperature. Temperature readings taken with a thermal camera can also give a good approximation of power dissipation with the use of this equation. The board layout has a major influence on the parameter . where, = Junction temperature (°C) = Ambient temperature (°C) = Junction to ambient thermal impedance (°C/W) = Power dissipation (voltage drop across device output current) (W) |
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